Vollautomatisierte SMT-Produktionslinie mit hochpräziser Bestückungstechnologie für eine effiziente und zuverlässige Elektronikfertigung.

AR Series Reflow Oven:
Your Choice for Reliable SMT Soldering

AR Series Reflow Oven –
Your Choice for Reliable SMT Soldering

AR Serie Reflow Ofen mit moderner Stickstoff-Technologie, bis zu 12 Heiz- und 3 Kühlzonen, ideal für SMT-Bestückung und bleifreies Löten

The AR Series Reflow Oven combines innovative technology with nitrogen integration to meet the demanding requirements of modern SMT production lines. Featuring up to 12 heating and 3 cooling zones, the AR Series provides precise and uniform thermal distribution, ensuring consistent, high-quality PCB processing.

Thanks to the optional nitrogen configuration, the AR Series minimizes oxidation during the reflow process, improving solder joint quality and long-term reliability. The advanced automation system includes automatic conveyor width adjustment, recipe management, and real-time process monitoring. The AR Series is fully Industry 4.0-ready, combining ease of use with cutting-edge technology.

AR Serie Reflow Ofen mit moderner Stickstoff-Technologie, bis zu 12 Heiz- und 3 Kühlzonen, ideal für SMT-Bestückung und bleifreies Löten

Why Reflow Soldering Is the Most Reliable Process

Source: https://www.youtube.com/watch?v=LCmia0Wsmqg

  • Uniform Thermal Distribution: Minimizes damage and ensures reliable solder joints.

  • Precise Temperature Control: Reduces thermal stress on sensitive components.

  • Efficient Process Speed: Enables faster throughput than alternative soldering methods.

  • Optimized Thermal Profiles: Deliver perfect results even on complex PCB layouts.

  • Low Defect Rate: Prevents voids and incomplete joints.

Heating System of the AR Series

Schnittdarstellung des Heizsystems im AR Serie Reflow Ofen. Darstellung des Luftstroms durch Konvektionsdüsen zur effizienten Wärmeverteilung
Innenansicht des Heizsystems im AR Serie Reflow Ofen

The AR Series Reflow Oven is equipped with a high-performance heating system that ensures accurate and efficient heat transfer:

  • Efficient Convection: Forward and reverse flow reduce heat loss and maintain stable temperature zones.

  • Jet Nozzle Design: Ensures even thermal distribution, improving solder joint quality.

  • Extended Heating Zones: Enhance process stability and support larger PCBs.

  • Minimal Heat Loss: The system retains energy for quick recovery and consistent profiles.

  • Temperature Accuracy: Enables repeatable results and reduces process errors.

Schnittdarstellung des Heizsystems im AR Serie Reflow Ofen. Darstellung des Luftstroms durch Konvektionsdüsen zur effizienten Wärmeverteilung
Innenansicht des Heizsystems im AR Serie Reflow Ofen

Conveyor System of the AR Series

Nahaufnahme des automatischen Fördersystems im Innenansicht des Heizsystems im AR Serie Reflow Ofen mit stabilen und langlebigen Komponenten
Innenansicht des AR Serie Reflow Ofens mit mehreren Stützpunkten zur Sicherstellung der Stabilität und Vermeidung von PCB-Verformungen
Detailansicht des Doppelkettensystems im AR Serie Reflow Ofen für präzise Förderung und reduzierte Ölkontamination
Dual-Lane-Fördersystem des AR Serie Reflow Ofens für erhöhte Flexibilität und Effizienz bei der SMT-Produktion

The AR Series features a robust and flexible conveyor system, designed to accommodate various PCB sizes and production needs:

  • Automatic Width Adjustment: Adapts seamlessly to different board sizes.

  • Multiple Support Points: Prevent board warping and ensure stable transportation.

  • Dual-Chain Mechanism: Prevents oil contamination on PCBs for a cleaner process.

  • Durable Components: High-quality materials reduce wear and increase reliability.

  • Adjustable Conveyor Speed: Meets the demands of different product types.

Key Benefits of the AR Series

  • Stable Temperature Control: Minimal deviation for perfect soldering results.

  • Efficient Heating Technology: Rapid recovery under high production loads.

  • Automated Processes: Width adjustment and recipe control without manual intervention.

  • Easy Maintenance: Reliable operation thanks to premium components.

  • Energy Efficiency: Reduced heat loss ensures lower operational costs.

Reflow Oven with Nitrogen: Why It Matters

Reflow Oven with Nitrogen:
Why It Matters

AR Series reflow ovens are available in standard and nitrogen-enabled configurations to meet diverse production requirements. The nitrogen option introduces inert gas into the reflow chamber, displacing oxygen and minimizing oxidation during soldering. This is particularly critical for high-reliability applications such as automotive and medical electronics.

  • Reduced Oxidation: Prevents oxide formation that weakens solder joints.

  • Improved Wetting: Enhances solder paste flow and joint formation.

  • Fewer Defects: Reduces voids and blowholes, ensuring stronger connections.

  • Higher Reliability: Ideal for demanding environments and sensitive components.

  • Lower Production Costs: Reduced rework and scrap help optimize long-term costs.

Learn more about nitrogen benefits on our N2-Generator page. We also offer free expert consultation on integrating nitrogen into your reflow process.

Reflow Process in the AR Series Oven

AR Serie Reflow Ofen mit geöffneter Haube. Sichtbare Innenkomponenten einschließlich Steuerung, Elektronikmodule und Fördersystem, ideal für Wartung und Einblicke in die Technologie
AR Series Reflow Oven with Open Hood – Internal Components Including Control Units, Electronics Modules, and Conveyor System. Ideal for Maintenance and Technical Inspection

Reflow soldering is one of the most accurate and efficient methods for assembling PCBs. The AR Series reflow oven follows a precise four-phase process:

  • 1

    Preheating (Ramp up zone): Boards are gradually and evenly heated to reduce thermal stress and prepare the solder paste

  • 2

    Soaking: The temperature is stabilized to activate flux and eliminate oxides, optimizing paste performance.

  • 3

    Reflow: Temperature is raised to melt the solder, creating strong electrical connections while preventing overheating.

  • 4

    Cooling: Temperature is precisely lowered to avoid stress and ensure strong, stable joints. The integrated cooling system ensures rapid and controlled cooling.

AR Serie Reflow Ofen mit geöffneter Haube. Sichtbare Innenkomponenten einschließlich Steuerung, Elektronikmodule und Fördersystem, ideal für Wartung und Einblicke in die Technologie
AR Series Reflow Oven with Open Hood – Internal Components Including Control Units, Electronics Modules, and Conveyor System. Ideal for Maintenance and Technical Inspection
  • Automatic recipe change via barcode scanner
  • Automatic conveyor width adjustment (via recipe or numeric input)
  • N2 flow meter
  • External water chiller with flux recovery system
  • Entry and exit covers
  • Oil pump
  • UPS (Uninterruptible Power Supply)
  • Auto start/stop timer
  • Keyence SR710 barcode scanner
  • Universal scanner holder
  • Rapid Cooling Unit AR-1003N/DN
  • IPC-CFX (Connected Factory Exchange) Interface
  • Integrated 3-phase transformer
  • PCB Center Board Support (CBS)
  • Chain-guided automatic position adjustment
  • Single-lane air/nitrogen ovens up to 400°C
  • Fan speed monitoring (AR-1003/D/N/DN)
  • Conveyor width upgrade up to 610 mm (AR, AR-N only)
  • Temperature range upgrade from 300°C to 400°C (AR: Air, D, N, DN)
  • Switch between nitrogen and air mode (AR-N, AR-DN only)
  • CBS system with automatic position adjustment
  • Blower RPM monitoring
  • Oxygen analyzer (AR-N, AR-DN only)
  • MES integration (Industry 4.0 ready)
  • Advanced profiling robot ProBot (OEM by KIC)
  • KIC Auto Profiling System ProBot

Your SMT Production in Focus: Our Turnkey Solutions

Your SMT production deserves the optimal combination of efficiency, precision, and quality. Our turnkey SMT lines provide fully integrated solutions with perfectly synchronized machines and cutting-edge technologies to ensure maximum performance and process reliability.

  • SMT printers: Accurate solder paste deposition for highly reliable solder joints.

  • Pick-and-Place Machines: Component placement with maximum precision and speed.

  • Reflow ovens: Outstanding soldering quality with vacuum, nitrogen, or convection technology – supported by advanced temperature profiling.

  • SPI/AOI systems: Automated inspection for defect-free results and continuous process control.
  • Handling Systems: Seamless material flow to ensure efficient SMT line operation.

  • Industry 4.0: Automation and traceability software, including closed-loop feedback between critical process steps to ensure consistent quality and transparency.

Discover more about our complete SMT line solutions and get expert advice from our team to find the perfect setup for your production needs.

Did You Know? We also have a dedicated webshop where you can find in-depth information, complete technical specifications
and a wide range of additional equipment for your production line. Get expert advice or place your order quickly and securely.

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